Micro-cavity insert manufacturing process follows

Micro-cavity inserts production process as follows: ① A parts CAD drawing production reticle on a glass layer 10nm thick chromium plating film, according to the original definition of the light-transmissive and non-transmissive portion; ② wafer pretreatment by degreasing , polishing, pickling, washing purification methods of processing Custom plastic mold silicon surface to improve adhesion of the photoresist and the wafer; ③ aluminum evaporation, vapor deposition on a silicon wafer in a thickness of about 1μm aluminum film; ④ glue thrown in a silicon wafer uniformly coated with an aluminum layer of a positive photoresist film; covered ⑤ exposure, the wafer is coated with photoresist mask with a wavelength of ultraviolet light of 350 m through the photoresist mask selective irradiation; ⑥ development, Crate moldthe wafer was immersed in the developer after exposure, the photoresist was dissolved by the developer and irradiated portions except To get the same mask pattern; ⑦ to glue; ⑧ ICP etching, performed by plasma etching deep grooves; ⑨ to aluminum, the aluminum corrosion removal of the protective film, and ultimately obtained a partial structure micro-cavity inserts.